×

HPE ProLiant Gen9 Servers - What is Optimal, Increased and Maximum Cooling?

lixiaoyao lixiaoyao 发表于2020-12-02 08:09:18 浏览1966 评论0

抢沙发发表评论

Issue

  • What is Optimal, Increased and Maximum Cooling?

Alert/Event Code :

Error Codes :

Environment

  • HPE ProLiant Gen9 Servers

Cause

  • Informational

Resolution

NOTE:  UEFI system configuration options vary by platform and the specific components that are installed in your system. Therefore, you might not see some of the options that are documented here. For more information about each option, see the UEFI System Utilities User Guide for HPE ProLiant Gen9 Servers .

Thermal Configuration

Use this option to select the fan cooling method for the system. Modifying this option is only advised for configurations that differ from typical Hewlett Packard Enterprise-supported configurations that cannot be cooled adequately via Optimal Cooling.




Setting the thermal configuration


1. From the System Utilities screen, select System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options > Fan and Thermal Options > Thermal Configuration and press Enter.



2. Select a setting and press Enter.


a. Optimal Cooling - Provides the most efficient solution by configuring fan speeds to the minimum required to provide adequate cooling.


b. Increased Cooling - Operates fans at a higher speed.


c. Maximum Cooling - Provides the maximum cooling available for the system.


3. Press F10.

©Copyright 2020 Hewlett Packard Enterprise Development LPHewlett Packard Enterprise Development shall not be liable for technical or editorial errors or omissions contained herein. The information provided is provided "as is" without warranty of any kind. To the extent permitted by law, neither HPE nor its affiliates, subcontractors or suppliers will be liable for incidental, special or consequential damages including downtime cost; lost profits; damages relating to the procurement of substitute products or services; or damages for loss of data, or software restoration. The information in this document is subject to change without notice. Hewlett Packard Enterprise Development and the names of Hewlett Packard Enterprise Development products referenced herein are trademarks of Hewlett Packard Enterprise Development in the United States and other countries. Other product and company names mentioned herein may be trademarks of their respective owners.


访客